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The diversity of applications for electronic devices has led to increased severity of shock loading, as well as a larger range of shock impulses that are applied based on the usage environment.
Strain Gage Testing: Standardization
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These concerns demand that the bending and flexure of the PCB during assembly, test, handling and transportation, ic well as actual product application, be characterized and controlled closely to safeguard the reliability of the lead-free PCBA interconnection.
Amazon Restaurants Food delivery from local restaurants. As the electronics industry shifts toward finer-pitch BGA components, thinner PCBs and lead-free interconnects, the robustness of second-level interconnects SLIs may be affected adversely.
Mechanical shock test guidelines for solder joint reliability – CERN Document Server
Concerns about second-level interconnect SLI failures due to excessive flexure during board- and system-level assembly and test operations increase with the use of finer-pitch BGA components, thinner PCBs and lead-free interconnects Figure 1. There also is a growing realization that fractures do not occur strictly on the manufacturing line. With the insight that this data provides, companies are better positioned to design ipd manufacture more mechanically reliable products.
Board-flexure control using strain gage measurement has proven effective in preventing these occurrences, and continues to gain acceptance as a method to identify stressful processes during manufacturing, handling, testing and assembly. Mudasir Ahmad, manufacturing engineer, Cisco Systems, may be contacted at ; mudasir.
Strain Gage Testing: Standardization
AmazonGlobal Ship Orders Internationally. Many manufacturers may find flexure to be a problem as they ramp up to full lead-free production. When paired with computational analysis techniques, SGT provides insights on the stresses that critical packages are subjected to during such conditions.
These estimates will, in turn, help suppliers define the strain targets necessary for their devices.
IPC/JEDEC-9703: MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITY
The document sets forth methodologies for determining the usage environment at the system level – designing representative board and component-level tests that can be used to judge robustness for the application. Stacked rosette strain gage with pre-attached wires. Even though the strength of the solder joints has not changed significantly, the change in mechanical properties concentrates the stresses on outer solder balls, causing them to reach critical loads more quickly.
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In addition to isolating potentially problematic operations, SGT validates that processes are operating within allowable strain levels. While the industry may never be able to fully eradicate solder-joint fractures, the use of SGT will help companies develop more robust manufacturing processes and increase product quality and reliability levels. Higher soldering temperatures also can have an adverse impact on the reliability of the PCB, inducing failure modes such as warpage, delamination and Cu-trace cracking.
The document also provides reference strain limits. There is the need for more collaborative research on the topic of strain limits. As SGT continues to gain momentum in the electronics industry, it is clear that it has evolved from a simple failure-analysis method to a standardized process-characterization tool.
The primary issue is the increased stiffness of the lead-free solder alloys, which prevents the outer rows of solder balls from distributing as much stress to adjacent rows. Read more Read less. This is why many manufacturers are required to operate under strain levels specified by their customers or component suppliers.
View shipping rates and policies Average Customer Review: Would you like to tell us about a lower price? The high strain imposed by clamps and test probes often make test fixtures a major culprit of solder-joint fracture due to excessive board flexure.
Perhaps the most pressing area of development is that of real estate, particularly in mobile computing platforms and small consumer devices. Withoutabox Submit to Film Festivals. As we approach the July lead-free deadline, the transition to lead-free processes continues to cause anxiety.
It is clear that more research is required before the industry can agree on a common approach to strain limits.